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PLAN WELL,PAY SMART
|Material||Pure Copper, Heat Conduction Silica Gel|
|Features||Type: Heatsink,for Laptop PC. Material: Pure copper,Heat Conduction Silica Gel. Thermal conductivity: 410W/mk. Size: 67x18x2mm. To Fit: M.2 SSD, NGFF SSD, NVME SSD.(length 80 mm x width 20 mm,4.2mm high.)|
|Weight||20g / 0.05lb.|
|Package Contents||1x Cooling Heatsink. 1x Silica Gel Pad. Ties.|
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